Exacting Build-to-Print Precision

From Slider
To Silicon.

Your blueprints, our standard of excellence. Merging 22 years of HDD physical contact rigor with high-fidelity semiconductor interconnect fabrication.

Since 2003
Probing Heritage
20μm Pitch
Fabrication Mastery
IPC Class 3
Compliance Standard

Manufacturing Integrity

Precision Built
To Specification.

Galaxy Tech operates as a high-fidelity manufacturing integrator. We translate complex client drawings into reliable physical hardware through stringent material selection and sub-micron process control.

“We ensure your design is executed with absolute mechanical and electrical consistency.”

Professional macro view of a Galaxy Tech high-density interconnect carrier board with hard gold surface finish. This engineering-grade PCBA demonstrates sub-micron trace precision and impedance-matched signal paths for advanced semiconductor testing and Flip-Chip assembly.

Quality Verification

Digital Proof of
Execution.

Build-to-print excellence is verified by data. Using in-house X-Ray metrology and active calibration, we provide the verified logs that prove our manufactured output perfectly matches your design parameters.

VIEW OUR VALIDATION PROTOCOLS ➔

In-house 2D X-ray non-destructive inspection of Flip-Chip micro-bump arrays, demonstrating sub-micron alignment and interconnect integrity for high-density semiconductor test solutions and probe card fabrication.

Integrated Global Operations.

Strategic HQ

Hong Kong

Supply Chain Orchestration & IP Oversight.

Technical Liaison

Japan

Advanced Material Sourcing & JDM Liaison.

Manufacturing

Dongguan

Agile High-Precision Workshop (ISO 9001).