30 Years of Engineering Lineage

From Slider
To Silicon.

Galaxy Tech was established in 2003, but our engineering core possesses a 30-year lineage in magnetic recording test development. We bring the rigor of Tier-1 storage supply chains to the semiconductor future.

30 YearsEngineering DNA
20μm PitchFabrication Mastery
R² = 1.0Validation Standard

The Pedigree

Stability Through
System-Level Insight.

Our expertise is rooted in the deep mastery of the test environment. By re-engineering thermal burn-in systems for storage titans like TDK and IBM, we gained the mechanical insights required to build stable 20μm probe cards that perform flawlessly under extreme stress.

Primary Business

Specialized
Build-to-Print Probing.

We translate your most complex test site blueprints into high-fidelity hardware. Supporting 20μm staggered pitch and up to 6,000+ PIN counts with verified WRe and Pd Alloy metallurgy.

  • • Micron-level alignment accuracy (±3.0μm)
  • • High-density interconnect processing
  • • Structural Reinforcement for high-RPM simulation

Yield Optimization

Optimizing Silicon
Performance.

Utilizing full-stack Agilent (Keysight) systems, we don’t just verify signals; we write optimization parameters directly back to the EEPROM registers, ensuring verified R² = 1.0 accuracy for Flip Chip assemblies.

VIEW VALIDATION WORKFLOW ➔

Integrated Operations

Exacting
Manufacturing.

Building on our roots since 2003, we maintain high-reliability in-house capabilities for high-layer PCBA, specialized ESD coatings, and sub-micron solder integrity for high-lead-count BGA.

ISO 9001:2015 | IPC-Class 3 Compliance

Global Engineering Network.

Strategic HQ

Hong Kong

Strategic Logistics & IP Oversight.

Technology Liaison

Japan

Material Sourcing & JDM Liaison.

Manufacturing Unit

Dongguan

Agile High-Precision Workshop.