30 YEARS
HDD Engineering DNA
20μm PITCH
Ultra-Narrow Fabrication
AGILENT-DRIVEN
Active Calibration Mastery

Galaxy Tech senior engineer overseeing the re-engineering and thermal optimization of burn-in systems, demonstrating high-level engineering insight for semiconductor testing.

Engineering Hub

STABILITY THROUGH
SYSTEM-LEVEL INSIGHT

Our fabrication excellence is rooted in our deep mastery of the test environment. By re-engineering thermal burn-in systems for maximum uniformity, we gained the thermal-mechanical insights required to build stable 20μm probe card architectures that perform flawlessly under extreme stress.

SPECIALIZED PROBE CARD
BUILD-TO-PRINT PROCESSING

  • 🚀 20μm Ultra-Narrow Pitch: Micron-level alignment accuracy.
  • 🚀 Logic & Memory Focus: High-density interconnect processing.
  • 🚀 Structural Reinforcement: High-voltage & large-current stability.
  • 🚀 100% IP Security: Pure contract manufacturing focus.
Detailed macro view of high-precision probe card fabrication by Galaxy Tech, showcasing 20um narrow-pitch probe arrays and structural reinforcement for logic and memory semiconductor testing.

Galaxy Tech performing real-time active calibration on PCBA assemblies using Agilent high-bandwidth oscilloscopes for signal integrity validation and parameter write-back.

ACTIVE CALIBRATION:
OPTIMIZING SILICON PERFORMANCE

Utilizing full-stack Agilent (Keysight) systems, we don’t just verify signals—we write optimization parameters directly back to chip registers, ensuring 100% functional alignment for Flip Chip assemblies.

Agilent-Verified Post-Assembly Validation

Foundational
Manufacturing

Building on our roots since 2003, we maintain high-reliability in-house capabilities for agile lamination, specialized ESD coatings, and high-precision soldering.

READY TO EXECUTE YOUR
NEXT-GEN TEST INTERFACE?

Consult with our engineering team for specialized Build-to-Print processing and Agilent-verified calibration.

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