What is PCB Layout?

PCB Layout is to achieve the circuit designer’s rquirement based on the circuit schematic diagram. During the PCB Layout process, various factors such as the layout of external connections, optimized layout of internal electronic components, optimized layout of metal connections and through holes, electromagnetic protection, heat dissipation, etc. need to be considered.

After years of research and practice, Galaxy can well meet PCB Layout requirements and can provide you with high-quality and fast PCB Layout services.

PCB Layout is a very complex design process. There are many factors that need to be considered during design. These factors are sometimes contradictory to each other: for example, when high-speed devices are laid out close together, although delay can be reduced, crosstalk and significant thermal effects may occur. Therefore, in the design, we weighed various factors and made a comprehensive compromise: not only meeting the high-speed PCB Layout requirements, but also reducing the complexity of the design. By comprehensively considering timing requirements, stripline and microstrip, signal matching scheme, signal quality, signal routing topology, power supply decoupling, high-speed signal return current return path signal impedance control, impedance control and lamination Stackup control, single board EMC/EMI strategy analysis, blind via and buried via, etc., and from the perspective of high-speed PCB layout, use our experience to optimize your schematic design, thereby making your single board’s intrinsic quality higher and the operation is more stable.

PCB Layout Notes:

• When arranging parts, arrange all circuits together as much as possible and keep the traces as short as possible.
• The IC ground decoupling capacitor should be as close as possible to the IC pin to increase the effect.
• If the voltage difference between the two lines is large, please pay attention to the safety distance.
• The current size of each circuit, that is, the heating condition, should be considered to determine the thickness of the copper foil.
• When the line corners, try to have sharp angles. It is best to use obtuse angles and arcs for right angles.
• For high-frequency circuits, it is best not to run the two lines in parallel for too long to reduce the influence of distributed capacitance. Generally, the top and bottom lines are used.
• High-frequency circuits must consider the high-frequency impedance of the ground wire. Generally, a large-area grounding method is used, and each point is grounded nearby to reduce the inductance component of the ground wire and make the potentials of each street location similar.
• The traces of high-frequency circuits should be thick and short to reduce the impact of inductance and high-frequency impedance on the circuit caused by too long traces.
• When arranging parts, generally similar parts should be arranged together as neatly as possible, and polar components should be in the same direction as possible to reduce potential production costs.
• For RF models, the parts of the power supply should be kept as far away from the receiving board as possible to reduce interference.
• For TF models, the transmitter should be as far away from the PIR as possible to reduce interference to the PIR during transmission.

In addition to PCB layout, GALAXY also provides PCB manufacturing services. Commonly used material includes Rogers, Dupont, Panasonic, and Shengyi. Our expertise extends to a variety of surface finishes, including Gold Plating, Hot Air Solder Level (HASL), Lead-Free HASL, Organic Solderability Preservative (OSP), Immersion Silver, Immersion Tin, Electroless Nickel Immersion Gold (ENIG), and Flash Gold, with the capability of achieving gold plating thicknesses of 0.5um or more. The minimum line width and line spacing can be 0.05mm. In Addition, we offer extra services such as ESD coating and Conformal coating to enhance the durability and performance of your PCBs.