Flip Chip Assembly Service

Flip chip assembly, also known as flip chip bonding, involves directly connecting components via bumps on the chip to a base board, carrier, or circuit board with the chip facing downwards. This contrasts with wire bonding, where the chip is oriented upwards during the connection process.

The growing popularity of flip-chip technology stems from its superiority in terms of size, appearance, flexibility, reliability, and cost-effectiveness when compared to other technologies.

At Galaxy, we provide comprehensive turnkey flip chip assembly services, boasting 20 years of expertise in this domain, particularly in the field of hard disks. We are adept at chip bonding on various types of PCBs, including Rigid PCBA and Flex PCBA. Galaxy is notably proficient in offering prototype services for small to medium-volume production, ensuring high-quality, specialized solutions for our clients.

Flip Chip Assembly for Flex PCB Assembly:

Flip Chip Assembly for PCBA:

Flip Chip Assembly for Printed Circuit Board

Processing Features:

  • Chip solder balls down to 0.05mm in diameter.
  • The distance between the solder balls is as small as 0.1mm.
  • The positioning accuracy of SMT machines and equipment is approx. 12 microns.