FPC Fabrication Capability
| Item | Description | Standard | Advanced |
|---|---|---|---|
| Material | FCCL (adhesive) | Shengyi SF302:PI=0.5mil,1mil and 2mil; Cu=0.33oz,0.5oz and 1oz |
/ |
| Material | FCCL (Adhesiveless) | Panasonic R‐F775:PI=1mil and 2mil;Cu=0.33oz, 0.5oz and 1oz/DuPont Pyralux AP:PI=1mil, 2mil and 3mil;Cu=0.33oz, 0.5oz and 1oz | PI=1mil,2mil; Cu=2oz /PI=1mil, 2mil, 3mil and 4mil; Cu=2oz |
| Material | Coverlay | Shengyi SF302C: 0515, 1025 and 2030/Taiflex FHK: 0515,1025 and 2035 | / |
| Material | Adhesive | Taiflex BT: AD=10um, 25um and 40um | / |
| Material | PI stiffener | Taiflex MHK: PI=3mil, 5mil, 7mil and 9mil | / |
| Material | 3M | 9460, 6677, 9458, 468 | / |
| Inner layer | Min. line width/spacing (12/18um copper) | 3/3mil(loop lines 5/5mil ) | 2.5/2.5mil(loop lines 4/4mil) |
| Inner layer | Min. line width/spacing (35um copper) | 3.5/3.5mil(loop lines 6/6mil) | 3/3mil(loop lines 5/5mil) |
| Inner layer | Min. line width/spacing (70um copper) | 6/8mil(loop lines 8/10mil) | 5/7mil(loop lines 7/9mil) |
| Inner layer | Max. copper thickness | 2oz | 3oz |
| Outer layer | Min. line width/spacing (18um copper) | 3/3mil(loop lines 6/6mil) | 2.5/2.5mil(loop lines 5.5/5.5mil) |
| Outer layer | Min. line width/spacing (35um copper) | 4/4mil(loop lines 8/8mil) | 3.5/3.5mil(loop lines 7.5/7.5mil) |
| Outer layer | Min. line width/spacing (70um copper) | 6/9mil(loop lines 10/13mil) | 5.5/8.5mil(loop lines 9.5/12.5mil) |
| Outer layer | Min. line width/spacing (105um copper) | 10/13mil(loop lines 12/15mil) | 9.5/12.5mil(loop lines 11.5/14.5mil) |
| Outer layer | Max. finished copper thickness | 3oz | 5oz |
| Drilling | Min. distance between via and conductors | 6mil (<4 layer)/8mil (4~6 layer )/12mil (7‐8 layer ) | 5mil (<4 layer)/7mil (4~6 layer )/10mil (7‐8 layer ) |
| Drilling | Min. mechanical drill hole | 6mil | 4mil |
| Solder mask and silk screen |
Solder mask color | green | / |
| Solder mask and silk screen |
Min. solder dam (base copper ≤1oz) | 4mil(green), 8.0mil(solder dam on the large copper) | / |
| Solder mask and silkscreen |
Min. clearance | 3mil(part for 2.5mil) | / |
| Solder mask and silkscreen |
Silk color | white, yellow | / |
| Surface treatment |
Surface treatment | HASL , ENIG, ENEPIG, Electrolytic Nickel Gold, Soft gold, Hard gold, Immersion silver, and OSP |
Immersion tin |
| Surface treatment |
Mixed surface treatment | ENIG+OSP,ENIG+G/F | / |
| Surface treatment |
Gold thickness (ENIG) | 0.05‐0.10um | / |
| Surface treatment |
Nickel thickness (ENIG) | 3‐6um | / |
| Surface treatment |
Gold thickness (ENEPIG) | 0.05‐0.10um | / |
| Surface treatment |
Palladium thickness (ENEPIG) | 0.05‐0.15um | / |
| Surface treatment |
Nickel thickness (ENEPIG) | 3‐6um | / |
| Surface treatment |
Electrolytic Nickel thickness | 3‐6um | / |
| Surface treatment |
Electrolytic Gold thickness | 0.05‐0.10um | / |
| Surface treatment |
Hard gold thickness(including lead) | 0.1‐1.5um | / |
| Surface treatment |
OSP thickness | 0.1‐0.3um | / |
| Surface treatment |
Immersion silver thickness | 0.2‐0.4um | / |
| Routing | Laser accuracy | ±0.05mm | / |
| Routing | Punching accuracy | ±0.05mm ‐ ±0.15mm | / |
| Others | Design software | CAM350、PROTEL、PADS、POWERPCB、AUTOCAD、 GENESIS、ORCAD |
/ |
| Others | Gerber format | RS‐274‐D、RS‐274‐X | / |
| Others | Drill format | EXCELLON format | / |
| Others | Layer | 1‐4 | 5‐8 |
| Others | Board thickness (without stiffener) | 0.1‐0.5mm | 0.6‐0.8mm |
| Others | Tolerance of single layer(without stiffener) |
±0.03mm | / |
| Others | Tolerance of double‐layer(≤0.3mm)(without stiffener) |
±0.05mm | ±0.03mm |
| Others | Tolerance of multi‐layer(＜0.3mm)(without stiffener) |
±0.05mm | ±0.03mm |
| Others | Tolerance of multi‐layer(0.3mm‐0.8mm)(without stiffener) |
±0.1mm | ±10% |
| Others | Tolerance of board thickness(including PI stiffener) | ±0.05mm | ±10% |
| Others | Tolerance of board thickness(including FR4 stiffener) | ±0.1mm | ±10% |
| Others | Min. board size | 5mm*10mm(without bridge);10mm*10mm(with bridge) | 2mm*4mm(without bridge);8mm*8mm(with bridge) |
| Others | Max. board size | 220mm*350mm | 220mm*575mm |
| Others | Impedance control tolerance | Single‐ended: ±5Ω(≤50Ω),±10%(>50Ω) /Differential: ±5Ω(≤50Ω),±10%(>50Ω) | Single‐ended: ±4Ω(≤50Ω),±8%(>50Ω)/Differential: ±4Ω(≤50Ω),±8%(>50Ω) |
| Others | Min. coverlay bridge | 8mil | / |
| Others | Min. bend radius of single layer | 3‐6 times of board thickness | / |
| Others | Min. bend radius of double‐layer | 6‐10 times of board thickness | / |
| Others | Min. bend radius of multi‐layer | 10‐15times of board thickness | / |
| Others | Min. dynamic bend radius | 20‐40 times of board thickness | / |