PCB Fabrication Capability
| Item | Description | Capability (Delivery area ＜5 Square meters ) | Capability (Delivery area ≥5 Square meters ) |
|---|---|---|---|
| Material | Normal FR4 | Shengyi S1141(Not recommend it to lead-free assembly process) | Shengyi S1141(Not recommend it to No-Pb assembly process) |
| Material | Normal Tg FR4(Halogen free) | Shengyi S1155 | Shengyi S1155 |
| Material | High Tg FR4(Halogen free) | Shengyi S1165 | Shengyi S1165 |
| Material | HDI PCB material | LDPP(IT-180A 1037&1086)、Normal PP 106&1080 | LDPP(IT-180A 1037&1086)、Normal PP 106&1080 |
| Material | Hight CTI | Shengyi S1600 | Shengyi S1600 |
| Material | High Tg FR4 | FR408、FR408HR、IS410、FR406、GETEK、PCL-370HR;IT180A、IT-150DA;N4000-13、N4000-13EP、 N4000-13SI、N4000-13EP SI;Megtron 4、Megtron 6(Panasonic);EM-827(Elite);GA-170(Grace Electron );NP- 180(Nanya);TU-752、TU-662(Taiwan Union);MCL-BE-67G(H)、MCL-E-679(W)、MCL-E-679F(J)(Hitachi);VT- 47(Ventec) |
IT180A、GETEK、PCL-370HR、N4000-13、N4000-13EP、N4000-13SI、N4000-13EP SI |
| Material | Ceramic Particle Filled Laminates | Rogers4350、Rogers4003、25FR、25N | Rogers4350、Rogers4003、25FR、25N |
| Material | PTFE Laminates | Rogers series、Taconic series、Arlon series、Nelco series、Taizhou Wangling F4BK series、TP series; | Taconic (TLX、TLF、TLY、RF、TLC、TLG series);Arlon(Diclad、AD series) |
| Material | PTFE PP | Taconic TP series、TPG series、TPN series、HT1.5(1.5mil)、Fastrise series | Shengyi S1141(Not recommend it to No-Pb assembly process) |
| Material | Hybrid laminating | Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) |
| PCB type | Rigid pcb | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、 Heavy copper power PCB、Backdrill、Semiconductor Test products. |
Backplane、HDI、High multi-layer blind&buried PCB、Backdrill |
| Buildings | Blind&buried via type | mechanical blind&burried vias with less than 3 times laminating | mechanical blind&burried vias with less than 2 times laminating |
| Buildings | HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating |
| Finish treatment |
Lead-free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、 Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finger |
Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、 ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finger |
| Finish treatment |
Leaded | Leaded HASL | Leaded HASL |
| Finish treatment |
aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、 ENEPIG);8:1(OSP) |
| Finish treatment |
Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； |
HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； |
| Finish treatment |
MIN finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； |
HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； |
| Finish treatment |
PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2- 7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm； OSP 0.2-6.0mm； |
HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1- 5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4- 5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm； |
| Finish treatment |
MAX high to gold finger | 1.5inch | 1.5inch |
| Finish treatment |
Min space between gold fingers | 6mil | 8mil |
| Finish treatment |
Min block space to gold fingers | 7.5mil | 7.5mil |
| Plating/coating thickness |
Tin thickness | 2-40μm (0.4μm on the large tin area of Leaded HASL, 1.5μm on the large tin area of HASL lead-free) | 2-40μm (0.4μm on the large tin area of Leaded HASL, 1.5μm on the large tin area of HASL lead-free) |
| Plating/coating thickness |
OSP | 0.2-0.6μm | 0.2-0.6μm |
| Plating/coating thickness | ENIG | Ni: 3-8μm; Au: 0.05-0.1μm | Ni: 3-8μm; Au: 0.05-0.1μm |
| Plating/coating thickness | Immersion Silver | 0.2-0.4μm | 0.2-0.4μm |
| Plating/coating thickness |
Immersion Tin | ≥1.0 | ≥1.0 |
| Plating/coating thickness |
Hard gold | 0.1-4.0μm | 0.1-2.0μm |
| Plating/coating thickness | Soft gold | 0.1-4.0μm | 0.1-4.0μm |
| Plating/coating thickness |
ENEPIG | Ni: 3-8μm, Pd:0.05-0.15μm, Au: 0.05-0.1μm | Ni: 3-8μm, Pd:0.05-0.15μm, Au: 0.05-0.1μm |
| Plating/coating thickness |
Flash gold (electroplated gold) | Ni:≥3μm ; Au: 0.025-0.1μm ;base copper≤1 oz | Ni:≥3μm ; Au: 0.025-0.1μm ;base copper≤1 oz |
| Plating/coating thickness |
electroplated Gold finger | Ni:≥3μm ; Au: 0.25-1.5μm(The Thinnest point) | Ni:≥3μm ; Au: 0.25-1.5μm(The Thinnest point) |
| Plating/coating thickness |
Carbon | 10-50μm | 10-50μm |
| Plating/coating thickness |
Soldermask | 0.4-0.7mil (on copper area), 0.2-0.31mil(on via pad),≥0.2mil(on circuits around the corner, just for one-time print and copper thickness<48um) |
0.4-0.7mil (on copper area), 0.2-0.31mil(on via pad),≥0.2mil(on circuits around the corner, just for one-time print and copper thickness<48um) |
| Plating/coating thickness |
Blue plastic | 8–31.5mil | 8–16mil |
| hole | MAX thickness of the mechanical hole 4mil/6mil/8mil |
31.5mil/59mil/100mil | 24mil/47mil/63mil |
| hole | Min laser drilling size | 4mil | 4mil |
| hole | Finished mechanical hole size | 4-244mil(corresponding drilling tool size 6-248mil) | 5-244mil(corresponding drilling tool size 8-248mil) |
| hole | MAX aspect ratio for Hole plate | 20:1（hole diameter＞8mil） | 10:1 |
| hole | The max aspect ratio for laser via filling plating |
1:1(Dpeth included copper thickness) | 0.9:1(Dpeth included copper thickness) |
| hole | The max aspect ratio for mechanical depth control drilling board(Blind hole drilling depth/blind hole size) |
1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | 0.8:1(drilling tool size≥10mil) |
| hole | Min. depth of Mechanical control ( back drill) |
8mil | 8mil |
| hole | Min gap between hole wall and conductor (None blind and buried via PCB) |
5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | 7mil(≤8L),9mil(10-14L),10mil(＞14L) |
| hole | Min gap between hole wall conductor (Blind and buried via PCB) |
7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) |
| hole | Min gab between hole wall conductor (Laser blind hole buried via PCB) |
7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） |
| hole | Min space between laser holes and conductor | 5mil | 6mil |
| hole | Min space between hole walls in different net | 10mil | 10mil |
| hole | Min space between hole walls in same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) |
| hole | Min space bwteen NPTH hole walls | 8mil | 8mil |
| hole | Hole location tolerance | ±2mil | ±2mil |
| hole | NPTH tolerance | ±2mil | ±2mil |
| hole | Pressfit holes tolerance | ±2mil | ±2mil |
| hole | Countersink depth tolerance | ±6mil | ±6mil |
| hole | Countersink hole size tolerance | ±6mil | ±6mil |
| Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) |
| Pad(ring) | Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) |
| Pad(ring) | Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 7mil | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold ) |
| Pad(ring) | Pad size tolerance(BGA) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) |
| Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ： 3/3mil |
| Width/Space | Internal Layer | 1OZ: 3/4mil | 1OZ: 3/4mil |
| Width/Space | Internal Layer | 2OZ: 4/5mi | 2OZ: 4/5.5mil |
| Width/Space | Internal Layer | 3OZ: 5/8mil | 3OZ: 5/8mil |
| Width/Space | Internal Layer | 4OZ: 6/11mil | 4OZ: 6/11mil |
| Width/Space | Internal Layer | 5OZ: 7/13.5mil | 5OZ: 7/14mil |
| Width/Space | Internal Layer | 6OZ: 8/15mil | 6OZ: 8/16mil |
| Width/Space | Internal Layer | 7OZ: 9/18mil | 7OZ: 9/19mil |
| Width/Space | Internal Layer | 8OZ: 10/21mil | 8OZ: 10/22mil |
| Width/Space | Internal Layer | 9OZ: 11/24mil | 9OZ: 11/25mil |
| Width/Space | Internal Layer | 10OZ: 12/27mil | 10OZ: 12/28mil |
| Width/Space | External Layer | 1/3OZ：3/3mil | 1/3OZ：3.5/4mil |
| Width/Space | External Layer | 1/2OZ：3.5/3.5mil | 1/2OZ：3.9/4.5mil |
| Width/Space | External Layer | 1OZ: 4.5/5mil | 1OZ: 4.8/5.5mil |
| Width/Space | External Layer | 1.43OZ（positive）:4.5/6 | 1.43OZ（positive）:4.5/7 |
| Width/Space | External Layer | 1.43OZ（negative ）:5/7 | 1.43OZ（negative ）:5/8 |
| Width/Space | External Layer | 2OZ: 6/7mil | 2OZ: 6/8mil |
| Width/Space | External Layer | 3OZ: 6/10mil | 3OZ: 6/12mil |
| Width/Space | External Layer | 4OZ: 7.5/13mil | 4OZ: 7.5/15mil |
| Width/Space | External Layer | 5OZ: 9/16mil | 5OZ: 9/18mil |
| Width/Space | External Layer | 6OZ: 10/19mil | 6OZ: 10/21mil |
| Width/Space | External Layer | 7OZ: 11/22mil | 7OZ: 11/25mil |
| Width/Space | External Layer | 8OZ: 12/26mil | 8OZ: 12/29mil |
| Width/Space | External Layer | 9OZ: 13/30mil | 9OZ: 13/33mil |
| Width/Space | External Layer | 10OZ: 14/35mil | 10OZ: 14/38mil |
| Width/Space | Width tolerance | ≤10mil：+/-1.0mil | ≤10mil：+/-20% |
| Width/Space | Width tolerance | ＞10mil：+/-1.5mil | ＞10mil：+/-20% |
| Soldermask | MAX drilling tool size via filled with Soldermask (single side) |
35.4mil | 35.4mil |
| Soldermask | Soldermask color | Green matte/glossy, Yellow, Black, Blue, Red, White, Purple | Green matte/glossy, Yellow, Black, Blue, Red, White, Purple |
| Soldermask | Silkscreen color | White, Yellow, Black | White, Yellow, Black |
| Soldermask | MAX hole size for via filled with Blue glue aluminium |
197mil | 197mil |
| Soldermask | Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil |
| Soldermask | The max aspect ratio for via filled with resin board |
12:1 | 8:1 |
| Soldermask | Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)/Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area)/Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)/Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)/Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)/Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area)/Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)/Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) |
| Routing | Min space of the V-CUT does not reveal the copper ( Central Line of v-cut to internal /external circuits, H means board thickness) |
H≤40mil: 12mil(20°mean V-CUT angle),13mil(30°),14.6mil(45°)/40<H≤63mil: 14.2mil(20°),16mil(30°),20mil(45°)/63<H≤94.5mil: 16.5mil(20°), 20mil(30°),25.2mil(45°)/94.5<H≤118.1mil: 18.5mil(20°),23.2mil(30°),30.3(45°) | H≤40mil: 12mil(20°mean V-CUT angle),13mil(30°),14.6mil(45°)/40<H≤63mil: 14.2mil(20°),16mil(30°),20mil(45°)/63<H≤94.5mil: 16.5mil(20°), 20mil(30°),25.2mil(45°)/94.5<H≤118.1mil: 18.5mil(20°),23.2mil(30°),30.3(45°) |
| Routing | V-CUT symmetrical tolerance | ±4mil | ±4mil |
| Routing | MAX V-CUT lines | 100 | 100 |
| Routing | V-CUT angle tolerance | ±5° | ±5° |
| Routing | V-CUT angle | 20、30、45° | 20、30、45° |
| Routing | Gold finger bevelling | 20、30、45、60° | 20、30、45、60° |
| Routing | Gold finger bevelling tolerance | 236mil | 275.6mil |
| Routing | Min gap between the sides of gold finger and the shape edge line |
8mil | 10mil |
| Routing | Depth tolerance of depth-control groove milling |
±4mil | ±4mil |
| Routing | routing tolerance (edge to edge) | ±4mil | ±4mil |
| Routing | Min tolerance for routing slot（PTH） | width/length tolerance ±5mil | width/length tolerance ±5mil |
| Routing | Min tolerance for routing slot （NPTH） |
width/length tolerance ±4mil | width/length tolerance ±4mil |
| Routing | Min tolerance for drilling slot（PTH） | width tolerance ±3mil；Length/width≥2, length tolerance ±3mil; Length/width＜2, length tolerance ±4mil | width tolerance ±3mil；Length/width≥2, length tolerance ±3mil; Length/width＜2, length tolerance ±4mil |
| Routing | Min tolerance for drilling slot （NPTH） |
width tolerance ±2mil；Length/width≥2, length tolerance is±2mil; Length/width＜2,width and length tolerance ± 3mil |
3mil width tolerance ±2mil；Length/width≥2, length tolerance is±2mil; Length/width＜2,width and length tolerance ±3mil |
| Local mixed pressure |
Min gap between mechanical hole wall and conductor (Local mixed pressure area) |
12mil(local 10mil) | 12mil(local 10mil) |
| Local mixed pressure |
Min gap between mechanical hole wall and the junction of local mixed pressure |
10mil | 10mil |
| Metal substrate PCB |
Layer counts | 1-8L(Al-substrate、Cu-substrate);2-24L(Heatsink、Sweat bonding、Buried metal);1-2L(Ceramic-substrate) | 1-8L(Al-substrate、Cu-substrate);2-24L(Heatsink、Sweat bonding、Buried metal);1-2L(Ceramic substrate) |
| Metal substrate PCB |
PCB size (Finished) | Max: 24″*24″, Min: 0.2″*0.2″ (Al-substrate、Cu-substrate、Heatsink、Sweat bonding、Buried metal) | Max: 24″*24″, Min: 0.2″*0.2″ (Al-substrate、Cu-substrate、Heatsink、Sweat bonding、Buried metal) |
| Metal substrate PCB |
MAX PCB size(Ceramic-substrate PCB) |
MAX PCB size(Ceramic-substrate PCB) 4″ * 4″ |
MAX PCB size(Ceramic-substrate PCB) 4″ * 4″ |
| Metal substrate PCB |
PCB thickness (Finished) | 0.02″-0.2″ | 0.02″-0.2″ |
| Metal substrate PCB |
Copper thickness (Finished) | 0.5-10 oz | 0.5-10 oz |
| Metal substrate PCB |
Metal thickness | 0.02″-0.2″ | 0.02″-0.2″ |
| Metal substrate PCB |
Metal material type | AL:1100/1050/2124/5052/6061;Cu:c11000; Iron | AL:1100/1050/2124/5052/6061;Cu:c11000; Iron |
| Metal substrate PCB |
Min finished hole size &tolerance | NPTH: 20±2mil; PTH: 40±4mil(for Al-substrate、Cu-substrate)、8±4mil(for Heatsink、Sweat bonding、Buried metal) |
NPTH: 20±2mil; PTH: 40±4mil(for Al-substrate、Cu-substrate)、8±4mil(for Heatsink、Sweat bonding、Buried metal) |
| Metal substrate PCB |
Dimension tolerance | ±1.2mil | ±2mil |
| Metal substrate PCB |
PCB partial surface treatment | Leaded HASL/Lead free HASL; OSP; ENIG; ENEPIG ; Plating(Ni)Soft/Hard gold;Plating Sn | Leaded HASL/Lead free HASL; OSP; ENIG; ENEPIG ; Plating(Ni)Soft/Hard gold;Plating Sn |
| Metal substrate PCB |
Metal partial surface treatment | Cu:Plating Ni&Au ; Al:Anodic oxidation、Hard anodic oxidation coating、Chemical passivation; Physical treatment: Sandblasting、Wire drawing |
Cu:Plating Ni&Au ; Al:Anodic oxidation、Hard anodic oxidation coating、Chemical passivation; Physical treatment: Sandblasting、Wire drawing |
| Metal substrate PCB |
Material | Metal PCB:Totking(T-110、T-111)、Ventec(VT-4A1、VT-4A2、VT-4A3)、Laird(1KA04、1KA06); Bergquist(MP06503、HT04503)、TACONIC(TLY-5、TLY-5F) | Metal PCB:Totking(T-110、T-111)、Ventec(VT-4A1、VT-4A2、VT-4A3)、Laird(1KA04、 1KA06);Bergquist(MP06503、HT04503)、TACONIC(TLY-5、TLY-5F) |
| Metal substrate PCB |
Thermal glue thickness (dielectric layer) | 3-6mil | 3-6mil |
| Metal substrate PCB |
Buried copper block size | 0.118″ * 0.118″ — 2.756″ * 3.15″ | 0.118″*0.118″ — 2.756″*3.15″ |
| Metal substrate PCB |
Buried copper block drop tolerance | ±1.6mil | ±1.6mil |
| Metal substrate PCB |
Min gap between Buried copper block and hole wall | 12mil | 12mil |
| Metal substrate PCB |
Thermal conductivity | 0.3-3w/m.k(Heatsink、Al-substrate、Cu-substrate);8.33w/m.k(Sweat bonding);0.35-3w/m.k(Buried metal);24-180 w/m.k(Ceramic-substrate) |
0.3-3w/m.k(Heatsink、Al-substrate、Cu-substrate);8.33w/m.k(Sweat bonding);0.35-3w/m.k(Buried metal);24-180 w/m.k(Ceramic-substrate) |
| Others | Max finished copper thickness to internal&external layer |
Internal layer:10 oz; External layer:11 oz | Internal layer:4oz; External layer:5 oz |
| Others | finished copper thickness to the external layer |
base copper 1/3 oz、0.5 oz：≥35.8μm（reference value：35.8-42.5μm）；≥40.4μm（reference value：40.4- 48.5μm）/base copper 1 oz、1.43 oz、2 oz：≥55.9μm；≥70μm；≥86.7μm/base copper 3oz、4 oz：≥117.6μm；≥148.5μm |
base copper 1/3 oz、0.5 oz：≥35.8μm（reference value：35.8-42.5μm）；≥40.4μm（reference value：40.4-48.5μm）/base copper 1 oz、1.43 oz、2 oz：≥55.9μm；≥70μm；≥86.7μm/base copper 3oz、4 oz：≥117.6μm；≥148.5μm |
| Others | Layer count | 1-40L | 1-20L |
| Others | PCB thickness | 8 – 275.6mil(No Soldermask);15.7-275.6mil(Have Soldermask) | 11.8-196.85mil(No Soldermask);15.7-196.85mil(Have Soldermask) |
| Others | PCB thickness tolerance（Normal ） |
Thickness＞40mil: ±10% ；Thickness≤40mil: ±4mil | Thickness＞40mil: ±10% ；Thickness≤40mil: ±4mil |
| Others | PCB thickness tolerance（Special ） | Thickness≤80mil: ±4mil ；80mil＜Thickness≤120mil: ±6mil | Thickness≤80mil: ±10% ；80mil＜Thickness≤120mil: ±6mil |
| Others | Min finished PCB size | 0.4″ * 0.4″ | 2.0″ * 4.0″ |
| Others | Max finished PCB size | 23×35 inch(2L) ; 22.5*33.5 inch(4L)；22.5*30inch（≥6L） | 20×30 inch(2L) ; 22.5*30 inch(4L)；16.5*22.5inch（≥6L） |
| Others | ionic soil | ≤1ug/cm2 | ≤1ug/cm2 |
| Others | Min bow&twist | 0.1%(This ability request same laminated plate type, symmetry laminated construction, the difference of symmetry layer Copper area within 10%, uniformity wiring, excluding the large area of copper and base material, haven’t plate and single panel, and the long side size≤ 21 inches) |
0.75% |
| Others | Impedance Tolerance | ±5ohm(＜50ohm), ±10%(≥50ohm) | ±5ohm(<50ohm),±10%(≥50ohm) |
| Others | Laser blind via size with filling plating | 4-5mil(priority 4mil) | 4-5mil(priority 4mil) |
| Others | The max aspect ratio for laser via filling plating |
1:1(Depth included copper thickness) | 1:1(Depth included copper thickness) |