Rigid Flex PCB Fabrication Capability
| Item | Description | Standard | Advanced |
|---|---|---|---|
| Material | FCCL（adhesive） | Shengyi SF302:PI=0.5mil,1mil and 2mil; Cu=0.33oz,0.5oz and 1oz |
/ |
| Material | FCCL（adhesiveless） | Panasonic R‐F775:PI=1mil and 2mil;Cu=0.33oz, 0.5oz and 1oz/DuPont Pyralux AP:PI=1mil, 2mil and 3mil;Cu=0.33oz, 0.5oz and 1oz | PI=1mil,2mil; Cu=2oz/PI=1mil, 2mil, 3mil and 4mil; Cu=2oz |
| Material | Coverlay | Shengyi SF302C: 0515, 1025 and 2030/Taiflex FHK: 0515,1025 and 2035 | / |
| Material | Adhesive | Taiflex BT: AD=10um, 25um and 40um | / |
| Material | PI stiffener | Taiflex MHK: PI=3mil, 5mil, 7mil and 9mil | / |
| Material | 3M | 9460, 6677, 9458, 468 | / |
| Material | NO FLOW PP | Ventec:VT‐47N | Ventec:VT‐901 |
| Material | CCL | ITEQ: IT‐180A; Shengyi: S1000‐2 | / |
| Material | Other CCL | Arlon: 85N; Rogers: RO4000 series; Nelco:N4000‐13 series | Ventec:VT‐901 |
| Inner layer | Min. line width/spacing (12,18um copper) | 3.5/3.5mil (3.2/3.2mil) | 3/3mil (2.8/2.8mil) |
| Inner layer | Min. line width /spacing (35um copper) | 4/4mil ( 3.5/3.5mil) | 3.5/3.5mil (3/3mil) |
| Inner layer | Min. line width/spacing (70um copper) | 6/7mil (5.5/6.5mil) | 5/6mil (4.5/5.5mil) |
| Inner layer | Annular ring(blind via) | 4mil | 3mil |
| Inner layer | Max. copper thickness | 2oz | 3oz |
| Outer layer | Min. line width /spacing (18um copper) | 4/4mil (3.5/3.5mil) | 3.5/3.5mil (3/3mil) |
| Outer layer | Min. line width /spacing (35um copper) | 4.5/4.5mil (4/4mil) | 4/4mil (3.5/3.5mil) |
| Outer layer | Min. line width /spacing (70um copper) | 6/9mil (5.5/8.5mil) | 5.5/8.5mil (5/8mil) |
| Outer layer | Min. line width /spacing (105um copper) | 10/13mil (9.5/12.5mil) | 9.5/12.5mil (9/12mil) |
| Outer layer | Min. line width /spacing (18um copper, flex on the surface of board) | 5/5mil (4.5/4.5mil) | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.5/4.5mil (4/4mil) |
| Outer layer | Min. line width /spacing (35um copper, flex on the surface of board) | 5.5/6mil (5/5.5mil) | 5/5.5mil (4.5/5mil) |
| Outer layer | Min. line width /spacing (70um copper, flex on the surface of board) | 7.0/10mil (6.5/9.5mil) | 6.5/9.5mil (6/9mil) |
| Outer layer | Min. BGA pad size | 12mil(8mil for electrical soft gold board) | 10mil(7mil for electrical soft gold board) |
| Outer layer | Max. finished copper thickness | 3oz | 5oz |
| Drilling | Blind via | / | 4mil‐6mil(6mil preferable) |
| Drilling | Max. buried via | 0.4mm | / |
| Drilling | Aspect ratio (mechanical drill) | 10:1 | 12:1 |
| Drilling | Aspect ratio (laser drill) | / | 0.8:1 |
| Drilling | Min. distance between via and conductors | 6mil (≤6layer)/8mil(7~11layer)/12mil(≥12layer) | 5mil (≤6layer) /6mil(7~11layer) /10mil(≥12layer) |
| Drilling | Min. distance between blind via and conductors | / | 6mil |
| Drilling | Tolerance of non‐plated holes | ±2mil(limited is +0/‐2mil or +2mil/‐0) | / |
| Solder mask and silk screen |
Solder mask color | green,black,blue,red, matte green,white | / |
| Solder mask and silk screen |
Min. solder dam (copper≤1oz) | 4mil(green, red and blue), 5mil(black and white) | / |
| Solder mask and silk screen |
Min. solder dam (copper2‐4oz) | 8mil | 6mil |
| Solder mask and silk screen |
Min. clearance | 2.5mil (2.0mil) | 2.0mil (1.5mil) |
| Solder mask and silk screen |
Diameter of plugged hole | / | 0.2‐0.5mm |
| Solder mask and silk screen |
Aspect ratio(hole plugged with non‐conductive resin) |
/ | 10:1 |
| Solder mask and silk screen |
silk color | white,yellow,black | / |
| Surface treatment |
Surface treatment | HASL/LF HASL, ENIG, ENEPIG, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Immersion silver, Immersion tin and OSP |
/ |
| Surface treatment |
Mixed surface treatment | ENIG+OSP,ENIG+Gold finger,Electrical gold+ Gold fingers | / |
| Surface treatment |
Gold thickness (ENIG) | 0.05‐0.10um | / |
| Surface treatment |
Nickel thickness (ENIG) | 3‐8um | / |
| Surface treatment |
Gold thickness (ENEPIG) | 0.05‐0.10um | / |
| Surface treatment |
Palladium thickness (ENEPIG) | 0.05‐0.15um | / |
| Surface treatment |
Nickel thickness (ENEPIG) | 3‐8um | / |
| Surface treatment |
Hard gold thickness (leadless) | 0.1‐1.5um | / |
| Surface treatment |
Hard gold thickness (including lead) | 0.1‐4.0um | / |
| Surface treatment |
Electrolytic Nickel thickness | ≥3um | / |
| Surface treatment |
Electrolytic Gold thickness | 0.05‐0.10um | / |
| Surface treatment |
Immersion silver thickness | 0.2‐0.4um | / |
| Surface treatment |
OSP thickness | 0.1‐0.3um | / |
| Routing | Tolerance of board outline | ±4mil(exclude complicated board outline and cutout) | / |
| Others | Design software | CAM350、PROTEL、PADS、POWERPCB、AUTOCAD、 GENESIS、ORCAD |
/ |
| Others | Gerber format | RS‐274‐D、RS‐274‐X | / |
| Others | Drill format | EXCELLON format | / |
| Others | Layer | 2‐10 | 11‐20 |
| Others | Board thickness | 0.2mm‐3.0mm | 3.0mm‐4.0mm |
| Others | Tolerance of boad thickness(thickness＞1.0mm) | ±10% | / |
| Others | Tolerance of boad thickness (thickness ≤1.0mm) | ±0.1mm | / |
| Others | Min. board size | 10mm*15mm | / |
| Others | Max. board size | 400mm*550mm | 400mm*730mm |
| Others | Impedance control tolerance | Single‐ended: ±5Ω(≤50Ω),±10%(>50Ω)/Differential: ±5Ω(≤50Ω),±10%(>50Ω) | Single‐ended: ±4Ω(≤50Ω),±8%(>50Ω)/Differential: ±4Ω(≤50Ω),±8%(>50Ω) |
| Others | HDI | / | 1+n+1(buried via≤0.4mm) |
| Others | Min. bow&twist | 0.75%(symmetrical),2%(unsymmetrical) | 1.5%(unsymmetrical) |